3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link-Reference-Cited by-同舟云学术

3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link

Published:2010-04 Issue:4 Volume:45 Page:856-862
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Saen Makoto,Osada Kenichi,Okuma Yasuyuki,Niitsu Kiichi,Shimazaki Yasuhisa,Sugimori Yasufumi,Kohama Yoshinori,Kasuga Kazutaka,Nonomura Itaru,Irie Naohiko,Hattori Toshihiro,Hasegawa Atsushi,Kuroda Tadahiro

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/4/5437471/05437487.pdf?arnumber=5437487

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