A Hybrid Deep Learning-Based Framework for Chip Packaging Fault Diagnostics in X-Ray Images
Author:
Affiliation:
1. School of Aeronautics and Astronautics, Sun Yat-Sen University, Guangzhou, China
2. China Aerospace Components Engineering Center, Beijing, China
3. College of Photonic and Electronic Engineering, Fujian Normal University, Fuzhou, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/9424/10666802/10539348.pdf?arnumber=10539348
Reference50 articles.
1. Automated visual inspection in the semiconductor industry: A survey
2. An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection
3. Multi-scale GAN with transformer for surface defect inspection of IC metal packages
4. A Pixel-Level Segmentation Convolutional Neural Network Based on Deep Feature Fusion for Surface Defect Detection
5. You Only Look Once: Unified, Real-Time Object Detection
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