Accelerated crack growth of nanoporous low-k glasses in CMP slurry environments
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/9318/29623/01345760.pdf?arnumber=1345760
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mechanical stability of airgaps in nano-interconnects;Microelectronics Reliability;2020-04
2. Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics;Applied Physics Letters;2017-10-16
3. In-situ scanning electron microscopy study of fracture events during back-end-of-line microbeam bending tests;Applied Physics Letters;2014-11-24
4. Mechanical Stability of Porous Low-k Dielectrics;ECS Journal of Solid State Science and Technology;2014-10-21
5. Integration Challenges of Nanoporous Low Dielectric Constant Materials;IEEE Transactions on Device and Materials Reliability;2009-12
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