Electrostatic Reliability Characteristics of GaN Flip-Chip Power Light-Emitting Diodes With Metal–Oxide–Silicon Submount-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Electrostatic Reliability Characteristics of GaN Flip-Chip Power Light-Emitting Diodes With Metal–Oxide–Silicon Submount

Published:2010-01 Issue:1 Volume:57 Page:119-124
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Chang Liann-Be,Chiang Kuo-Ling,Chang Hsin-Yi,Jeng Ming-Jer,Yen Chia-Yi,Lin Cheng-Chen,Chang Yuan-Hsiao,Lai Mu-Jen,Lee Yu-Lin,Soong Tai-Wei

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/16/5357518/05340648.pdf?arnumber=5340648

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of Silicon-Doping in n-AlGaN Layer on the Optical and Electrical Performance of Deep Ultraviolet Light-Emitting Diodes;Russian Journal of Physical Chemistry A;2019-12

2. Improvement in electrostatic discharge robustness of a gallium‐nitride‐based flip‐chip high‐electron mobility transistor with a metal–insulator–metal capacitor structure;IEEJ Transactions on Electrical and Electronic Engineering;2019-03-12

3. Phosphor-Free InGaN White Light Emitting Diodes Using Flip-Chip Technology;Materials;2017-04-20

4. Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules;Applied Sciences;2016-06-20

5. Comparison of silicone and spin-on glass packaging materials for light-emitting diode encapsulation;Thin Solid Films;2014-11

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP