Author:
Dae Hyun Kim ,Sung Kyu Lim
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. 3-D IC: An Overview of Technologies, Design Methodology, and Test Strategies;Advances in Intelligent Systems and Computing;2020-11-24
2. Making a Case for Partially Connected 3D NoC;ACM Journal on Emerging Technologies in Computing Systems;2020-10-02
3. Fast 3D Integrated Circuit Placement Methodology using Merging Technique;Defence Science Journal;2019-04-30
4. Three-dimensional Floorplan Representations by Using Corner Links and Partial Order;ACM Transactions on Design Automation of Electronic Systems;2019-01-31
5. Embodied engineering;Proceedings of the 23rd International ACM Conference on 3D Web Technology;2018-06-20