A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC-Reference-Cited by-同舟云学术

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A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Pi Yudan,Wang Ningyu,Zhang Jiaxi,Wang Wei,Luo Guojie,Miao Min,Xu Wenhua,Jin Yufeng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545687.pdf?arnumber=7545687

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks;Journal of Circuits, Systems and Computers;2024-07-20

2. An efficient 3D IC partitioning approach using satin bowerbird optimization for reduced TSV count and improved heat dissipation;Engineering Research Express;2023-11-14

3. 3D IC Partitioning Approach for Achieving Lower TSV Count and Reduced Heat Dissipation using Particle Swarm Optimization;2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT);2022-02-16

4. Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits;Applied Thermal Engineering;2021-03

5. Thermal-Aware Modeling and Analysis for a Power Distribution Network Including Through-Silicon-Vias in 3-D ICs;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2019-07

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