Author:
Wang Daixing,Wang Wei,Jin Yufeng
Cited by
2 articles.
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1. A fast and simple method to place sub-die under Chip-let architecture based on thermal simulation;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. A layout-to-simulation approach for thermal design of IC;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01