InFO (Wafer Level Integrated Fan-Out) Technology
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545402.pdf?arnumber=7545402
Cited by 71 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Yttria substitution effect of tantalate aluminosilicate glasses with ultra‐high Young's modulus;Journal of the American Ceramic Society;2024-07
2. Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Advanced FO-PLP with Multi-chip for Wearable Application;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Bayesian Optimization of Large Glass Package Architecture for System-Level Reliability in High-Performance Computing Applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. Advanced Fan-Out Embedded Chip Process Integration for 3D Application;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
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