2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages-Reference-Cited by-同舟云学术

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2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Ravichandran Siddharth,Yamada Shuhei,Park Giback,Chen Han-Wen,Shi Tailong,Buch Chintan,Liu Fuhan,Smet Vanessa,Sundaram Venky,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429612.pdf?arnumber=8429612

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