Key Properties for Successful Ultra Thin Die Pickup
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999677.pdf?arnumber=7999677
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Coupled Excitation Strategy for Crack Initiation at the Adhesive Interface of Large-Sized Ultra-Thin Chips;Processes;2023-05-26
2. Ultra thin die pickup: peel stage and pickup tool design comparison;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
3. Stress-less Dicing Solution for Thin and Large Die Handling for 2.5D/3D IC Packaging;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
4. New Packaging Technology for Disruptive 1- and 2- Dimensional VCSEL Arrays and Their Electro- Optical Performance and Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. New Assembly Technology for VCSEL arrays comprising ultra-thin diodes;2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC);2019-09
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