Fully Integrated Back-Biased 3d Hall Sensor with Wafer-Level Integrated Permanent Micromagnets-Reference-Cited by-同舟云学术

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Fully Integrated Back-Biased 3d Hall Sensor with Wafer-Level Integrated Permanent Micromagnets

Published:2023-01-15 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
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Author:

Gojdka Björn¹,Cichon Daniel²,Stahl-Offergeld Markus²,Schröder Dominik³,Clausen Niels¹,Hedayat Christian³,Hohe Hans-Peter²,Lisec Thomas¹

Affiliation:

1. Fraunhofer Institute for Silicon Technology ISIT,Germany

2. Fraunhofer Institute for Integrated Circuits IIS,Germany

3. Fraunhofer Institute for Electronic Nano Systems ENAS,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10052111/10052113/10052184.pdf?arnumber=10052184

Reference8 articles.

1. Alternative method to calculate the magnetic field of permanent magnets with azimuthal symmetry;camacho;Rev Mex Fis,2013

2. PowderMEMS—A Generic Microfabrication Technology for Integrated Three-Dimensional Functional Microstructures

3. Integration of polymer bonded magnets into magnetic sensors

4. Automated Filling of Dry Micron-Sized Particles into Micro Mold Pattern within Planar Substrates for the Fabrication of Powder-Based 3D Microstructures

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