Author:
Yates Luke,Sood Aditya,Cheng Zhe,Bougher Thomas,Malcolm Kirkland,Cho Jungwan,Asheghi Mehdi,Goodson Kenneth,Goorsky Mark,Faili Firooz,Twitchen Daniel J.,Graham Samuel
Cited by
15 articles.
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1. Development of Diamond Device-Level Heat Spreader for the Advancement of GaN HEMT Power and RF Electronics;IEEE Transactions on Device and Materials Reliability;2023-12
2. High thermal conductivity in wafer-scale cubic silicon carbide crystals;Nature Communications;2022-11-23
3. Advancement of GaN HEMT Power Electronics on Diamond Substrate;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
4. Device-level Transient Cooling of β-Ga2O3 MOSFETs;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Thermoreflectance Imaging of (Ultra)wide Band-Gap Devices with MoS2 Enhancement Coatings;ACS Applied Materials & Interfaces;2021-08-27