Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique-Reference-Cited by-同舟云学术

Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique

Published:2023-02 Issue:2 Volume:38 Page:1468-1478
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Zhang Zheng¹^ORCID,Chen Chuantong¹^ORCID,Suetake Aiji¹,Ishino Hiroshi²,Sampei Hirokazu²,Endo Takeshi²,Sugiura Kazuhiko²^ORCID,Tsuruta Kazuhiro²,Suganuma Katsuaki¹^ORCID

Affiliation:

1. Flexible 3D System integration Laboratory (F3D), SANKEN, Osaka University, Osaka, Japan

2. Power Electronics Development Department, MIRISE Technologies Corporation, Nisshin, Japan

Funder

Flexible 3D System integration Laboratory

MIRISE Technologies Corporation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9952160/09903576.pdf?arnumber=9903576

Reference38 articles.

1. Thermal Fluid Simulation Modeling Based on Thermal Transient Test and Fatigue Analysis of Asymmetric Structural Double-Sided Cooling Power Module

2. Effects of solder joint shape and height on thermal fatigue lifetime

3. Prediction of fatigue crack growth in steel bridge components using acoustic emission

4. Study of fatigue crack characteristics by acoustic emission

5. General framework for acoustic emission during plastic deformation

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Condition Monitoring of Discrete Power Devices: A Data-Driven Approach With Stress Quantification and Mold Temperature Sensing;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-06

2. Analysis of Stress Wave Characteristics in SiC MOSFETs with Solder Layer Voids;2024 3rd International Conference on Energy, Power and Electrical Technology (ICEPET);2024-05-17

3. Condition monitoring of SiC power assembly by using time-series analysis of acoustic emission during power cycling tests;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. Thermo-mechanical fatigue induced unexpected strain hardening of Cu clip wiring on transfer-mold type EV power modules;International Journal of Fatigue;2023-07

5. Comparative Investigation on Aging Precursor and Failure Mechanism of Commercial SiC MOSFETs Under Different Power Cycling Conduction Modes;IEEE Transactions on Power Electronics;2023-06