Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA
Author:
Affiliation:
1. Western Digital®, SanDisk Storage Malaysia Sdn.Bhd.,Penang,Malaysia
2. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia,Selangor,Malaysia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9969384/9969385/09969487.pdf?arnumber=9969487
Reference14 articles.
1. Reassessment of stereometric quantitative measurements on the growth of intermetallic compound for solder connections;bakar;Sains Malaysiana,2018
2. Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
3. IPC-7095D-WAMl;Design and assembly process implementation for ball grid arrays (BGAs) IPC International,2019
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