Thermal Analysis and Test Condition Definition of Power cycling Tests for a 6-in-1 Double Side Cooling SiC Power Module-Reference-Cited by-同舟云学术

Thermal Analysis and Test Condition Definition of Power cycling Tests for a 6-in-1 Double Side Cooling SiC Power Module

Published:2022-12-07 Issue: Volume: Page:
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Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Tang Gongyue¹

Affiliation:

1. Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research),Singapore,138634

Funder

Science and Engineering Research Council

A*STAR (Agency for Science, Technology and Research), Singapore

Publisher

IEEE

Link

Reference12 articles.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Performance Of Cold Plate Cooling Of Sic Power Transistor In TO 247 Package;2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM);2024-06-19

2. Thermal Management of 6-in-1 SiC Power Module with Double-Sided Impingement Cooling;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Double-side Liquid Cooling Development for 6-in-1 SiC Power Module;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05