Sliding Mode Control of a Distributed-Parameter Wafer Spin Clean Process-Reference-Cited by-同舟云学术

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Sliding Mode Control of a Distributed-Parameter Wafer Spin Clean Process

Published:2021-09 Issue:5 Volume:29 Page:2271-2278
ISSN:1063-6536
Container-title:IEEE Transactions on Control Systems Technology
language:
Short-container-title:IEEE Trans. Contr. Syst. Technol.

Author:

Koch Stefan^ORCID,Kleindienst Martin^ORCID,Moreno Jaime A.^ORCID,Horn Martin^ORCID

Funder

Austrian Federal Ministry for Digital and Economic Affairs

Österreichische Nationalstiftung für Forschung, Technologie und Entwicklung

Christian Doppler Research Association

Papiit-UNAM Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx7/87/9507573/09234521.pdf?arnumber=9234521

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of a Compact and Contactless Stage Capable of Levitating/Rotating Wafer Functioning as an Ultrasonically Virtual Hand;IEEE Transactions on Industrial Electronics;2024-11

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3. An analysis on Pigford model for a liquid film developing over a rotating disk;Journal of Mechanical Science and Technology;2024-03

4. Longitudinal Velocity Regulation of UGVs: A Composite Control Approach for Acceleration and Deceleration;IEEE Transactions on Intelligent Transportation Systems;2023-10

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