Author:
Silberman J.,Aoki N.,Boerstler D.,Burns J.L.,Sang Dhong ,Essbaum A.,Ghoshal U.,Heidel D.,Hofstee P.,Kyung Tek Lee ,Meltzer D.,Hung Ngo ,Nowka K.,Posluszny S.,Takahashi O.,Vo I.,Zoric B.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
24 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. References;Microprocessor 3;2020-11-06
2. A framework for high-speed parallel-prefix adder performance evaluation and comparison;International Journal of Circuit Theory and Applications;2014-09-09
3. Energy-performance tradeoffs in processor architecture and circuit design;ACM SIGARCH Computer Architecture News;2010-06-19
4. A Low-Power Embedded SRAM for Wireless Applications;IEEE Journal of Solid-State Circuits;2007-07
5. Pipelining to Reduce the Power;Closing the Power Gap Between ASIC & Custom;2007