Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
20 articles.
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1. Integrated Fabrication Process of Si Microcantilever Using TMAH Solution With Planar Molybdenum Mask;Journal of Microelectromechanical Systems;2023-06
2. Controlled sacrificial sidewall surface micromachining for the release of high length-to-thickness aspect ratio bridges;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2010-11
3. Fabrication of controlled sidewall angles in thin films using isotropic etches;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2003
4. Evolution of integrated-circuit vacuum processes: 1959–1975;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2000-07
5. Taper etching of the thermal oxide layer;IEE Proceedings I Solid State and Electron Devices;1986