Analytical Die-to-Die 3D Placement With Bistratal Wirelength Model and GPU Acceleration-Reference-Cited by-同舟云学术

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Analytical Die-to-Die 3D Placement With Bistratal Wirelength Model and GPU Acceleration

Published:2023 Issue: Volume: Page:1-1
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Liao Peiyu¹^ORCID,Zhao Yuxuan¹^ORCID,Guo Dawei²,Lin Yibo³^ORCID,Yu Bei¹^ORCID

Affiliation:

1. NT, The Chinese University of Hong Kong, Department of Computer Science and Engineering, Hong Kong

2. School of Electronics Engineering and Computer Science, Center for Energy-Efficient Computing and Applications, Peking University, China

3. School of Integrated Circuits, Peking University, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx7/43/6917053/10374268.pdf?arnumber=10374268

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Physical Design Challenges in Modern Heterogeneous Integration;Proceedings of the 2024 International Symposium on Physical Design;2024-03-12

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