Additively Manufactured Flexible On-Package Phased Antenna Arrays With Integrated Microfluidic Cooling Channels for 5G/mmWave System-on-Package Designs-Reference-Cited by-同舟云学术

Additively Manufactured Flexible On-Package Phased Antenna Arrays With Integrated Microfluidic Cooling Channels for 5G/mmWave System-on-Package Designs

Published:2023-06 Issue:6 Volume:33 Page:899-902
ISSN:2771-9588
Container-title:IEEE Microwave and Wireless Technology Letters
language:
Short-container-title:IEEE Microw. Wireless Tech. Lett.

Author:

Hu Kexin¹^ORCID,Callis Theodore W.¹^ORCID,Tentzeris Manos M.¹^ORCID

Affiliation:

1. Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, GA, USA

Funder

Army Research Laboratory with SEMI-FlexTech

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/9944983/10144809/10113177.pdf?arnumber=10113177

Reference13 articles.

1. Maximizing the Performance of a 3D Printed Heat Sink by Accounting for Anisotropic Thermal Conductivity During Filament Deposition

2. Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications

3. A Method of Electro-Mechanical Packaging with Embedded Cooling to Design Fully-Functional Core Structures for Scalable Active Phased Array Radars

4. Investigating inexpensive polymeric 3D printed materials under extreme thermal conditions

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