Reliability along the Value Chain – from Chip to Board/System
Author:
Affiliation:
1. Infineon Technologies AG,Regensburg,Germany
2. Infineon Technologies Austria AG,Villach,Austria
Funder
ECSEL JU project
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9966729/9966739/09966780.pdf?arnumber=9966780
Reference8 articles.
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3. SAC305 solder fatigue crack propagation under 3-point bending cycle test condition
4. Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads
5. Deformation measure-ment on cross sections of Fan-Out Wafer Level Package by Digital Image Correlation (DIC);maus;IEEE Electronic Systems Technology Conference,2022
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