A high-remelting-point interconnect method based on porous copper and Sn42Bi58 solder-Reference-Cited by-同舟云学术

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A high-remelting-point interconnect method based on porous copper and Sn42Bi58 solder

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Wang Jianqiang¹,Wang Haozhong¹,Lv Ziwen¹,Zhong Xiangxiang¹,Mao Xingchao¹,Chen Hongtao¹

Affiliation:

1. Harbin Institute of Technology (Shenzhen),Sauvage Laboratory for Smart Materials,Shenzhen,China

Funder

Natural Science Foundation of Guangdong Province

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873247.pdf?arnumber=9873247

Reference12 articles.

1. Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

2. Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

3. Growth evolution and formation mechanism of η′-Cu6Sn5 whiskers on η-Cu6Sn5 intermetallics during room-temperature ageing

4. Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging

5. Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment

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