Transient liquid phase bonding of Sn-Pb solder with added Ni particles
Author:
Affiliation:
1. Package R&D Center,Beijing Mxtronics Corporation,Beijing,China
2. PLA Rocket Force in Beijing,The 4th Military Representative Office of the Equipment Department,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873278.pdf?arnumber=9873278
Reference18 articles.
1. Transient liquid phase bonding of Sn–Bi solder with added Cu particles;omid;J Mater Sci Mater Electron,2016
2. The shear strength of transient liquid phase bonded Sn – Bi holder joint with Added Cu particles;omid;Advanced Powder Technology,0
3. Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach
4. Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations
5. Intrinsic and Interdiffusion in Cu-Sn System
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Ultrasonic-accelerated TLPB with Ga-Cu Paste Solder for Low-temperature Electronics Interconnects;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Low-temperature joining of semiconductor substrates and thin layers on solid and flexible wafers by solid-liquid inter-diffusion bonding using a low-thickness Ni-Sn system;2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP);2023-05-28
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