Prospects of Design of Electronic Equipment Enclosures by Means of Additive Technologies-Reference-Cited by-同舟云学术

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Prospects of Design of Electronic Equipment Enclosures by Means of Additive Technologies

Published:2024-02-29 Issue: Volume: Page:1-5
ISSN:
Container-title:2024 6th International Youth Conference on Radio Electronics, Electrical and Power Engineering (REEPE)
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Author:

Selivanov Kirill V.¹,Yakimov Artem O.¹,Volkov George A.¹,Lyskov Dmitriy S.¹

Affiliation:

1. Bauman Moscow State Technical University,Department of Design and Technology of Electronic Devices,Moscow,Russian Federation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10479558/10479559/10479765.pdf?arnumber=10479765

Reference18 articles.

1. Investigation of Quality and Identity of Similar Electronic Components from Different Manufacturers

2. Shrinkage predictions of injection moulded parts in semi-crystalline polymers: experimental verification

3. Development Trend of Electrification and Small-Scale Power Generation Sector in Russia

4. Application of additive technologies in the development of a vortex valve to control the thrust of a gas-jet drive

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