Intelligent Multi-Modal Sensing-Communication Integration: Synesthesia of Machines-Reference-Cited by-同舟云学术

Intelligent Multi-Modal Sensing-Communication Integration: Synesthesia of Machines

Published:2023 Issue: Volume: Page:1-1
ISSN:1553-877X
Container-title:IEEE Communications Surveys & Tutorials
language:
Short-container-title:IEEE Commun. Surv. Tutorials

Author:

Cheng Xiang¹^ORCID,Zhang Haotian¹^ORCID,Zhang Jianan¹^ORCID,Gao Shijian²^ORCID,Li Sijiang¹,Huang Ziwei¹^ORCID,Bai Lu³^ORCID,Yang Zonghui¹,Zheng Xinhu⁴^ORCID,Yang Liuqing⁵^ORCID

Affiliation:

1. School of Electronics, State Key Laboratory of Advanced Optical Communication Systems and Networks, Peking University, Beijing, P. R. China

2. Samsung Semiconductor, Samsung SoC Research and Development Lab, San Diego, CA, USA

3. Joint SDU-NTU Centre for Artificial Intelligence Research (C-FAIR), Shandong University, Jinan, P. R. China

4. Intelligent Transportation Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, P. R. China

5. Internet of Things Thrust and Intelligent Transportation Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, P. R. China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/9739/5451756/10330577.pdf?arnumber=10330577

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