Thermal Performance Comparisons of Different Spacer Structures in Double-Sided Cooling Power Modules
Author:
Affiliation:
1. Huazhong University of Science and Technology,School of Electrical and Electronic Engineering,Wuhan,China
2. AECC Aero Engine Control System Institute,Beijing,China
3. Beijing Institute of Precision Mechatronics and Controls,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10361838/10361943/10362479.pdf?arnumber=10362479
Reference9 articles.
1. Graphite-Embedded High-Performance Insulated Metal Substrate for Wide-Bandgap Power Modules
2. Thermal Characterization Analysis of IGBT Power Module Integrated with a Vapour Chamber and Pin-Fin Heat Sink;Chen
3. Double Sided Cooled Module concept for High Power Density in HEV Applications;Grassmann
4. Automotive High Power Module with Spacer on Die Bottom (Flip Chip) or Die Top (Wire Bond);Lin
5. A Double-Sided Bidirectional Power Module With Low Heat Concentration and Low Thermomechanical Stress
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