Carrierless design for handling and processing of ultrathin wafers-Reference-Cited by-同舟云学术

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Carrierless design for handling and processing of ultrathin wafers

Published:2010-06 Issue: Volume: Page:
ISSN:
Container-title:2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
language:
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Author:

Bieck Florian¹,Spiller Sven¹,Molina Froilan¹,Topper Michael²,Lopper Christina²,Kuna Ingrid²,Seng Tan Chuan³,Tabuchi Tomotaka⁴

Affiliation:

1. Doublecheck-Semiconductors Pte. Ltd., 8 Changi South Lane, Singapore

2. Fraunhofer IZM, Gustav-Meyer-Allee 25, 13355 Berlin, Germany

3. Division of Microelectronics, Nanyang Technological University, Singapore

4. Disco HiTech Europe GmbH, Liebigstrasse 8, 85551 Munich, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5482824/5490635/05490953.pdf?arnumber=5490953

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enabling backside processing for perforated microfluidic devices;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Dual-wafer intergrinding thinning by bipolar-discharge EDM with a capacity-coupled pulse generator considering large gap capacitance and minimization of discharge energy;Results in Engineering;2022-09

3. Efficacy of Photobiomodulation Therapy Versus Soft Acrylic Wafer for Reduction of Pain Associated with Orthodontic Metal Bracket Removal: A Clinical Trial;Photobiomodulation, Photomedicine, and Laser Surgery;2022-07-01

4. Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication;IEEE Transactions on Communications;2020-05

5. Double‐sided transistor device processability of carrierless ultrathin silicon wafers;InfoMat;2020-02-04

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