Impact of post-plating anneal and through-silicon via dimensions on Cu pumping-Reference-Cited by-同舟云学术

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Impact of post-plating anneal and through-silicon via dimensions on Cu pumping

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

De Messemaeker Joke,Pedreira Olalla Varela,Vandevelde Bart,Philipsen Harold,De Wolf Ingrid,Beyne Eric,Croes Kristof

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575633.pdf?arnumber=6575633

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