Pb-Free, High Thermal and Electrical Performance Driven Die Attach Material Development for Power Packages

Author:

Kim Byong Jin,Ryu Dong Su,Jeon HyeongIl,Hazellah Muhammad Hadhari,Chim Weng Tuck,Khim Jin Young

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. The Study of Process Enhancements to Improve Flash Removal Performance for Power Packages;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Thermoelectrical Parameters of SiC PiN Diodes with New Die Attachment Ag Paste;2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME);2023-10-18

3. Die attachment Process Overview for High Power Semiconductors;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

4. 3D Embedded Power Package Module to Integrate Various Power Systems;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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