High Density Ultra-Thin Organic Substrates for Advanced Flip Chip Packages-Reference-Cited by-同舟云学术

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High Density Ultra-Thin Organic Substrates for Advanced Flip Chip Packages

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Islam Nokibul,Tan K.H.,Yoon Seung Wook,Chen Tony

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811109.pdf?arnumber=8811109

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

2. Comparative study of solder size and volume effect on properties of Sn–3.0Ag–0.5Cu joints during isothermal aging;Journal of Materials Science: Materials in Electronics;2023-06

3. Covert Channel Communication as an Emerging Security Threat in 2.5D/3D Integrated Systems;Sensors;2023-02-13

4. Chip Partition Heterogeneous Integration and Chip Split Heterogeneous Integration;Chiplet Design and Heterogeneous Integration Packaging;2023

5. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

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