Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Author:
Affiliation:
1. Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin/Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5482824/5490635/05490961.pdf?arnumber=5490961
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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