Cu/epoxy interfacial adhesion improvement by thiol-based self assembled structures of different chain lengths-Reference-Cited by-同舟云学术

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Cu/epoxy interfacial adhesion improvement by thiol-based self assembled structures of different chain lengths

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
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Author:

He Peng,Yuen Matthew M. F.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5871442/5898472/05898582.pdf?arnumber=5898582

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Rough Nickel PPF for Mold Adhesion Improvment;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26

2. Rough Silver for Improved Lead-Frame Reliability;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26

3. Study on interfacial interaction energy of Cu–SAM–epoxy systems in a hot and humid environment;Journal of Adhesion Science and Technology;2013-09-16

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