Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level Integrations-Reference-Cited by-同舟云学术

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Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level Integrations

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Bertheau Julien,Inoue Fumihiro,Phommahaxay Alain,Peng lan,Iacovo Serena,Rassoul Nouredine,Sleeckx Erik,Rebibs Kenneth,Miller Andy,Beyer Gerald,Beyne Eric,Nakamura Atsushi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429534.pdf?arnumber=8429534

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31

2. Deformation Characteristics of Micron-level Thin Adhesive Layer for Bumpless Build Cube (BBCube) Integration Technology;2022 International Conference on Electronics Packaging (ICEP);2022-05-11

3. Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing;Electronic Materials Letters;2020-06-04

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