TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking-Reference-Cited by-同舟云学术

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TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
language:
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Author:

Na Duk Ju,Aung Kyaw Oo,Choi Won Kyung,Kida Tsuyoshi,Ochiai Toshihiko,Hashimoto Tomoaki,Kimura Michitaka,Kata Keiichirou,Yoon Seung Wook,Yong Andy Chang Bum

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897346.pdf?arnumber=6897346

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3. Types;Electronic Enclosures, Housings and Packages;2019

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