Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration-Reference-Cited by-同舟云学术

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Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Takano Takamasa,Kudo Hiroshi,Tanaka Masaya,Akazawa Miyuki

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811009.pdf?arnumber=8811009

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications;Advances in Patterning Materials and Processes XLI;2024-04-09

2. Role of Cu/SiO₂ Rough Interface in TSV for High-Power Device Under Electromigration;IEEE Transactions on Electron Devices;2023-10

3. Revolution of next-generation interconnect materials and key processes for advanced chips in post-moore era;SCIENTIA SINICA Chimica;2023-08-17

4. An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning;Micromachines;2023-07-30

5. Ultra-Fine Pitch Interconnects using a Novel Lift-off based Process of Thick Copper Films on Organic Substrate for Advanced Packaging;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

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