The Use Of Laser Technology For Recycling Hybrid Electronic Waste-Reference-Cited by-同舟云学术

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The Use Of Laser Technology For Recycling Hybrid Electronic Waste

Published:2022-10-20 Issue: Volume: Page:
ISSN:
Container-title:2022 International Conference and Exposition on Electrical And Power Engineering (EPE)
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Author:

Sover Alexandru¹,Zink Markus¹,Vogel T¹,Ciobanu Romeo Cristian²

Affiliation:

1. Ansbach University of Applied Sciences,Faculty of Technology,Ansbach,Germany

2. “Gheorghe Asachi” Technical University of Iasi,Dept. of Electrical Measurements and Electrotechnical Materials,Iasi,Romania

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9959087/9959072/09959803.pdf?arnumber=9959803

Reference18 articles.

1. A Sover 2019;IOP Conf Ser Mater Sci Eng,0

2. Paint Stripping and Removal Methods;A review of the risks associated with different paint stripping technologies,2019

3. Cleaning times: Paint stripping;durkee;It's just like parts cleaning Metal Finishing,2009

4. Liberation characteristic and physical separation of printed circuit board (PCB)

5. A comprehensive review on the recycling of discarded printed circuit boards for resource recovery, Resources, Conservation and Recycling;mir,2022

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sustainable recycling process for tantalum recovery from printed circuit boards;Resources, Conservation and Recycling;2023-11

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