Charge trapping challenges of CMOS embedded complementary FeFETs
Author:
Affiliation:
1. GlobalFoundries Module One LLC &Co. KG,Dresden,Germany
2. University of Notre Dame,Notre Dame,Indiana,USA
3. NaMLab gGmbH,Dresden,Germany
4. Ferroelectric Memory GmbH,Dresden,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10536936/10536916/10536957.pdf?arnumber=10536957
Reference12 articles.
1. First demonstration of in-memory computing crossbar using multi-level Cell FeFET
2. FeFET Reliability Modeling for In-Memory Computing: Challenges, Perspective, and Emerging Trends
3. FeFET: A versatile CMOS compatible device with game-changing potential
4. Interplay between oxygen defects and dopants: effect on structure and performance of HfO2-based ferroelectrics
5. Origin of the endurance degradation in the novel HfO2-based 1T ferroelectric non-volatile memories
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1. On the Thickness Scaling of Ferroelectric Hafnia;IEEE Transactions on Materials for Electron Devices;2024
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