Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

Author:

En-Xiao Liu ,Er-Ping Li ,Zaw Zaw Oo ,Xingchang Wei ,Yaojiang Zhang ,Vahldieck R.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Efficient EMI Analysis and Self-Shielding Design Method for Pin Map of System-in-Package;IEEE Transactions on Electromagnetic Compatibility;2023-12

2. Deep Reinforcement Learning-Based Ground-Via Placement Optimization for EMI Mitigation;IEEE Transactions on Electromagnetic Compatibility;2023-04

3. Electromagnetic Analysis in PINMAP Assignment Optimization Based on T-matrix Method;2022 IEEE 22nd International Conference on Communication Technology (ICCT);2022-11-11

4. Efficient Electromagnetic Modeling of Multidomain Planar Layered Medium by Surface Integral Equation;IEEE Transactions on Microwave Theory and Techniques;2021-08

5. A Surface Integral Equation Formulation for Efficient Simulation of Finite-Sized Multilayered Parallel-Plate Structure;IEEE Transactions on Microwave Theory and Techniques;2020-07

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