Co-simulation Design of RF Front-End Based on Three-Dimensional Vertical Interconnection of BGA-Reference-Cited by-同舟云学术

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Co-simulation Design of RF Front-End Based on Three-Dimensional Vertical Interconnection of BGA

Published:2023-08-18 Issue: Volume:36 Page:547-552
ISSN:
Container-title:2023 International Conference on Advances in Electrical Engineering and Computer Applications (AEECA)
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Author:

Zhong Yudi¹,Xu Lixin¹,Yang Jiajie¹

Affiliation:

1. Beijing Institute of Technolog,School of Mechatronical Engineering,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10511267/10511091/10512129.pdf?arnumber=10512129

Reference12 articles.

1. Development Trends and Challenges of Microsystem Functional Module Integration Technology;Zhihui;Electronic Process Technology,2015

2. Thermal Layout Study of Three-dimensional Microwave Components Based on Resin Encapsulation;Jincai;Journal of China Academy of Electronics and Information Technology,2011

3. PHASED-ARRAY RADARS: PAST, ASTOUNDING BREAKTHROUGHS AND FUTURE TRENDS;Brookner;Microwave Journal

4. Placement and Routing for 3-D System-On-Package Designs

5. Current Status and Development Prospects of SIP Packaging Technology;Zhenya;Electronics and Packaging,2009

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Vertical Interconnection Technology for RF MicroSystem Packaging;Materials;2024-07-11

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