Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs-Reference-Cited by-同舟云学术

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Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Susumago Yuki¹,Arayama Shunsuke¹,Hoshi Tadaaki¹,Kino Hisashi²,Tanaka Tetsu³,Fukushima Takafumi⁴

Affiliation:

1. Tohoku University,Graduate School of Engineering,Sendai,Japan

2. Tohoku University,Graduate School of Biomedical Engineering,Sendai,Japan

3. Tohoku University,Graduate School of Biomedical Engineering, and Graduate School of Engineering,Sendai,Japan

4. Tohoku University,Graduate School of Engineering, GINTI/NICHe, and Graduate School of Biomedical Engineering,Sendai,Japan

Funder

Tateisi Science and Technology Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816732.pdf?arnumber=9816732

Reference39 articles.

1. New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique

2. Self-Assembly Technologies for FlexTrate™

3. Direct multichip-to-wafer 3D integration technology using flip-chip self-assembly of NCF-covered known good dies

4. Temporary spin-on glass bonding technologies for via-last/backside-via 3D integration using multichip self-assembly

5. Flux-assisted self-assembly with microbump bonding for 3D heterogeneous integration

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1. Low-dimensional nanostructures for monolithic 3D-integrated flexible and stretchable electronics;Chemical Society Reviews;2024

2. Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03

4. Cu-Cu Hybrid Bonding;Chiplet Design and Heterogeneous Integration Packaging;2023

5. Chip Partition Heterogeneous Integration and Chip Split Heterogeneous Integration;Chiplet Design and Heterogeneous Integration Packaging;2023

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