Functional Interposer Embedded with Multi-Terminal Si Capacitor for 2.5D/3D Applications Using Planarization and Bumpless Chip-on-Wafer (COW)-Reference-Cited by-同舟云学术

Functional Interposer Embedded with Multi-Terminal Si Capacitor for 2.5D/3D Applications Using Planarization and Bumpless Chip-on-Wafer (COW)

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Satake Yoshiaki¹,Funaki Tatsuya¹,Kobinata Kyosuke²,Matsuno Hitoshi¹,Hidaka Seiji²,Abe Shunsuke¹,Ito Hiroyuki¹,Hsiao Chih-Cheng³,Li Sheng Yi³,Kim Youngsuk¹,Ohba Takayuki¹

Affiliation:

1. Tokyo Institute of Technology,Kanagawa,Japan

2. Murata Manufacturing Co., Ltd.,Kyoto,Japan

3. Industrial Technology Research Institute,Hsinchu,Taiwan

Funder

Tokyo Institute of Technology

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816575.pdf?arnumber=9816575

Reference9 articles.

1. Miniaturized 3D Functional Interposer Using Bumpless Chip-on-Wafer (COW) Integration with Capacitors

2. InFO (Wafer Level Integrated Fan-Out) Technology

3. Thinned wafer multi-stack 3DI technology

4. First Demonstration of Silicon-Like >250 I/O Per mm Per Layer Multilayer RDL on Glass Panel Interposers by Embedded Photo-Trench and Fly Cut Planarization

5. Voidless Chip-on-Wafer Process for Functional Interposer

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