Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics-Reference-Cited by-同舟云学术

Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Kim Min-Ki¹,Park Soojeoung¹,Jang Aeni¹,Lee Hyuekjae¹,Baek Seungduk¹,Lee ChungSun¹,Kim Ilhwan¹,Park Jumyong¹,Jee Youngkun¹,Kang Un-Byoung¹,Kim Dae-Woo¹

Affiliation:

1. Samsung Electronics Co., Ltd,Test & System Package,Cheonan-si,South Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816722.pdf?arnumber=9816722

Reference9 articles.

1. High TEC Copper to Connect Copper Bond Pads for Low Temperature Wafer Bonding

2. Die-to-Wafer (D2W) Processing and Reliability for 3D Packaging of Advanced Node Logic

3. Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

4. Die to Wafer Stacking with Low Temperature Hybrid Bonding;guilian;2020 IEEE 70th Electronic Components and Technology Conference (ECTC),2020

5. Measuring the surface bonding energy: A comparison between the classical double-cantilever beam experiment and its nanoscale analog

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