Inorganic Temporary Direct Bonding for Collective Die to Wafer Hybrid Bonding
Author:
Affiliation:
1. Yokohama National University,Yokohama,Japan
2. Disco corp.,Tokyo,Japan
3. Toray Engineering,Shiga,Japan
4. University of Tsukuba,Ibaraki,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195575.pdf?arnumber=10195575
Reference23 articles.
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2. Area-Selective Electroless Deposition of Cu for Hybrid Bonding
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4. Measurement of bonding energy in an anhydrous nitrogen atmosphere and its application to silicon direct bonding technology
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