Fabrication and Characterization of a MEMS Thermal Convective Accelerometer on Silicon-in-Glass Substrate-Reference-Cited by-同舟云学术

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Fabrication and Characterization of a MEMS Thermal Convective Accelerometer on Silicon-in-Glass Substrate

Published:2024-04-01 Issue:7 Volume:24 Page:9619-9625
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Ye Yizhou¹^ORCID,Wan Shu¹^ORCID,Li Shen¹^ORCID,Peng Yunhao²^ORCID,He Xuefeng¹^ORCID,Qin Ming³^ORCID

Affiliation:

1. Key Laboratory of Optoelectronic Technology and Systems, Ministry of Education, Chongqing University, Chongqing, China

2. 26th Research Institute of China Electronics Technology Group Corporation, Chongqing, China

3. Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China

Funder

National Natural Science Foundation of China

Key Project of Science and Technology Research Program of Chongqing Education Commission of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/7361/10487994/10438397.pdf?arnumber=10438397

Reference36 articles.

1. Wireless MEMS-Based Accelerometer Sensor Boards for Structural Vibration Monitoring: A Review

2. Review of micromachined optical accelerometers: from mg to sub-μg

3. Micromachined Accelerometers with Sub-µg/√Hz Noise Floor: A Review

4. Micromachined high-g accelerometers: a review

5. A review of micromachined thermal accelerometers

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Linearity Sensor Based on One-Step Laser Direct Writing Fabrication for Vibration Detection;ACS Applied Electronic Materials;2024-09-10

2. Low-Cost and Paper-Based Micro-Electromechanical Systems Sensor for the Vibration Monitoring of Shield Cutters;Sensors;2024-08-19

3. A Low-Power and Robust Micromachined Thermal Convective Accelerometer;Micromachines;2024-06-29

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