High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration-Reference-Cited by-同舟云学术

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High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Published:2012-12 Issue: Volume: Page:
ISSN:
Container-title:2012 International Electron Devices Meeting
language:
Short-container-title:

Author:

Liu Christianto C.,Chen Shuo-Mao,Kuo Feng-Wei,Chen Huan-Neng,Yeh En-Hsiang,Hsieh Cheng-Chieh,Huang Li-Hsien,Chiu Ming-Yen,Yeh John,Lin Tsung-Shu,Yeh Tzu-Jin,Hou Shang-Yun,Hung Jui-Pin,Lin Jing-Cheng,Jou Chewn-Pu,Wang Chuei-Tang,Jeng Shin-Puu,Yu Douglas C. H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6471855/6478950/06479039.pdf?arnumber=6479039

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. System technology co-optimization for advanced integration;Nature Reviews Electrical Engineering;2024-09-02

2. Fan-out PoP Solder Joint Reliability Investigation by System Power Cycling;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Reliability of Indium Solder Joints using a Laser-Assisted Bonding (LAB) Process at Room Temperature;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05

5. 1.1 Semiconductor Industry: Present & Future;2024 IEEE International Solid-State Circuits Conference (ISSCC);2024-02-18

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