Comprehensive Review and State of Development of Double-Sided Cooled Package Technology for Automotive Power Modules
Author:
Affiliation:
1. General Motors LLC, Detroit, MI, USA
Funder
General Motors Research and Development
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Medicine
Link
http://xplorestaging.ieee.org/ielx7/8782709/9669092/09769770.pdf?arnumber=9769770
Reference171 articles.
1. Comparison Study of Parasitic Inductance, Capacitance and Thermal Resistance for Various SiC Packaging Structures
2. A Review of Architectural Design and System Compatibility of Power Modules and Their Impacts on Power Electronics Systems
3. Electrical performance, reliability analysis, and characterization;burress,2017
4. Packaging Architectures for Silicon Carbide Power Electronic Modules
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. PCB-on-DBC GaN Power Module Design With High-Density Integration and Double-Sided Cooling;IEEE Transactions on Power Electronics;2024-01
2. Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink;Journal of Electronic Packaging;2023-12-06
3. Review of Hybrid Packaging Methods for Power Modules;Chinese Journal of Electrical Engineering;2023-12
4. Design and Characterization of a Novel Double-side Cooled Press-pack Packaging Structure;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29
5. Fabrication Process Optimization of A High- Power Double-Sided Cooled SiC Power Module;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3