Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies-Reference-Cited by-同舟云学术

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Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies

Published:2012-12 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)
language:
Short-container-title:

Author:

Gonzalez M.,Vandevelde B.,Ivankovic A.,Cherman V.,Debecker B.,Lofrano M.,De Wolf I.,Beyer G.,Swinnen B.,Tokei Z.,Beyne E.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6504698/6507037/06507142.pdf?arnumber=6507142

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage;Journal of Electronic Packaging;2023-11-23

2. Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. Influence of Thermally Aged Underfill on Flip-Chip Packages;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

4. Residual stress measurement of build-up layer in silicon wafers;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation;Microelectronic Engineering;2023-03

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