Thermal and power integrity based power/ground networks optimization
Author:
Publisher
IEEE Comput. Soc
Link
http://xplorestaging.ieee.org/ielx5/8959/28391/01268986.pdf?arnumber=1268986
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Complex Integrated Circuit Structure Transformation, Modeling and Simulation Method;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05
2. Equivalent Thermal Conductivity Model Based Full Scale Numerical Simulation for Thermal Management in Fan-Out Packages;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05
3. A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05
4. Research of Signal Integrality in PCB Design for ARM9 Core Board;Applied Mechanics and Materials;2014-09
5. Layout-Driven Post-Placement Techniques for Temperature Reduction and Thermal Gradient Minimization;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2013-03
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