In-situ infrared spectroscopy for chemical analysis in electronic packaging processes-Reference-Cited by-同舟云学术

In-situ infrared spectroscopy for chemical analysis in electronic packaging processes

Published:2022-09-13 Issue: Volume: Page:
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Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Niegisch Corinna¹,Haag Sabine¹,Braun Tanja²,Holck Ole²,Schneider-Ramelow Martin³

Affiliation:

1. Corporate Sector Research and Advance Engineering Robert Bosch GmbH,Renningen,Germany

2. Fraunhofer IZM,Departement System Integration and Interconnection Technologies,Berlin,Germany

3. Technical University Berlin,Faculty IV Electrical Engineering and Computer Science,Berlin,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939399.pdf?arnumber=9939399

Reference26 articles.

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4. Curing Kinetics Study by FTIR Spectroscopy and Properties Analysis of Methyl Silicone Resin Membrane

5. Development of Inter-Crosslinking Polymer Materials From DGEBA/PDMS-Epoxy Resin Systems: Processing And Application Study;suguna;Malaysian Polymer Journal,2010

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