Test Structures for the Wafer Mapping and Correlation of the Properties of Electroplated Ferromagnetic Alloy Films-Reference-Cited by-同舟云学术

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Test Structures for the Wafer Mapping and Correlation of the Properties of Electroplated Ferromagnetic Alloy Films

Published:2016-08 Issue:3 Volume:29 Page:201-208
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Sirotkin Evgeny,Smith Stewart^ORCID,Walker Ross,Terry Jonathan G.,Walton Anthony J.

Funder

EPSRC through the IeMRC Flagship Project on Smart Microsystems

Texas Instruments

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/66/7524665/07496953.pdf?arnumber=7496953

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